50mm Sapphire Wafer R9 Mirror Polished EPI Ready Wafer Edge R Type

Name: 50mm Sapphire Wafer R9 Mirror Polished EPI Ready Wafer Edge R Type
Brand: Shanghai GaNova Electronic Information Co., Ltd.
SKU: JDCD08-001-001
Price: 1,000.00 USD
Availability: InStock

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50mm Sapphire Wafer R9 Mirror Polished EPI Ready Wafer Edge R Type

Large Image : 50mm Sapphire Wafer R9 Mirror Polished EPI Ready Wafer Edge R Type

Product Details:

Model Number:	JDCD08-001-001

Payment & Shipping Terms:

Packaging Details:	Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Payment Terms:	T/T

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50mm Sapphire Wafer R9 Mirror Polished EPI Ready Wafer Edge R Type

Description

Diameter:	50.8 ±0.10	Surface Orientation:	A-Plane(11-20)
Laser Mark:	As Customer Required	Wafer Edge:	R-type
Material:	High Purity Al₂O₃(＞99.995%)	Thickness:	430 ±15μm
Highlight:	50mm Sapphire Wafer , Mirror Polished EPI Ready Wafer , Sapphire Wafer R9

High Purity Al₂O₃＞99.995% R9 Mirror Polished EPI-Ready Wafer edge R-type

JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length (mm) 16 LED chip,substrate material

High performance of Silicon (Si) and Germanium (Ge)-based devices can be made possible through Sapphire Substrate, which allows chipsets to be very fast in performance. The presence of Si and Ge ensures high electron mobility and low twin defect density in the chipsets. Electron mobility in the SiGe devices is higher than in the case of Si devices.

Parameters	Specification
Parameters	Unit	Target	Tolerance
Material	High purity Al₂O₃(＞99.995%)
Diameter	mm	50.8	±0.10
Thickness	μm	430	±15
Surface Orientation	C-Plane(0001)
-Off Angle toward M-axis	degree	0.20	±0.10
-Off Angle toward A-axis	degree	0.00	±0.10
Flat Orientation	A-Plane(11-20)
-Flat Off-set Angle	degree	0.0	±0.2
Flat Lenght	mm	16.0	±1
R-plane	R9
Front surface Roughness(Ra)	nm	＜0.3
Back surface Roughness	μm	0.8~1.2μm
Front surface Quality	Mirror Polished,EPI-Ready
Wafer edge	R-type
Chamfer amplitude	μm	80-160
Included angle radian between flat edge and round edge	mm	R=9
TTV	μm	≤5
LTV(5x5mm)	μm	≤1.5
Bow	μm	0~-5
Warp	μm	≤10
Laser mark		As customer required

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

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Contact Person: Xiwen Bai (Ciel)

Tel: +8613372109561

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