wafer automatic dicing saw online manufacture

DAD3350 Wafer Dicing Machine Automatic Dicing Saw 1.8 kW, 2.2 kW Process controls Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment ... Read More

DAD3350 Wafer Dicing Machine Automatic Dicing Saw X-Axis Cutting Range 260mm Supports a wide range of applications DAD3350 is capable of handling a maximum of 8-inch or 250 x 250 mm workpieces (user-specified ... Read More

DAD3350 Wafer Dicing Machine 0.1 600mm/s X-Axis Cutting Range 260mm Improved throughput The DAD3350 achieves improvement in throughput by increasing the speed of each axis. Ease of use Operability is improved ... Read More

0.1 600mm/s Wafer Dicing Machine 8 Inch (250 mm 250 mm, 300 mm User-Specified Specification) Supports a wide range of applications DAD3350 is capable of handling a maximum of 8-inch or 250 x 250 mm workpieces ... Read More

DAD3350 Wafer Dicing Machine X-Axis Cutting Range 260mm 1.8 KW, 2.2 KW Process quality By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage ... Read More